From 98nm to 12nm
Establishing advanced semiconductor manufacturing capabilities with cutting-edge process nodes and wafer technologies.
Process Node Evolution
Our roadmap spans from established nodes to cutting-edge technologies, enabling diverse applications from power management to AI acceleration.
Initial node for analog and power devices
Enhanced performance for mixed-signal applications
Advanced logic and SoC capabilities
Cutting-edge node for high-performance computing
Interactive Roadmap
Explore our technology roadmap with detailed process node specifications
Process Node Roadmap
Target Year: 2025
ProductionInitial node optimised for analog and power management devices.
Wafer Capabilities
Standard wafer size for cost-effective production of analog, power, and mixed-signal devices.
Large-diameter wafers for advanced logic and high-volume manufacturing of complex SoCs.
Packaging Solutions
Comprehensive packaging technologies for diverse application requirements
Ball Grid Array - High pin count
Quad Flat Package - Standard package
Chip Scale Package - Miniature size
Wafer Level Package - Advanced integration
Made in Africa, for the World
SILIFAB brings semiconductor manufacturing excellence to Africa, reducing dependence on imports and building local capabilities. Our fabs are designed with sustainable operations, water reclamation, and energy efficiency at their core.
Explore Our Capabilities
Learn more about our comprehensive semiconductor manufacturing capabilities and process technologies.